Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-12-26 |
| 9755016 | Integration process to form microelectronic or micromechanical structures | Wai-Kin Li | 2017-09-05 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow +3 more | 2017-06-20 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-03-21 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2017-01-03 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Griselda Bonilla, Ronald G. Filippi, Xiao Hu Liu, Naftali E. Lustig +1 more | 2017-01-03 |