| 9835653 |
Solder bump array probe tip structure for laser cleaning |
David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell +2 more |
2017-12-05 |
| 9776270 |
Chip joining by induction heating |
Stephen P. Ayotte, Glen E. Richard, Timothy M. Sullivan |
2017-10-03 |
| 9773726 |
Three-dimensional integrated circuit integration |
Thomas A. Wassick |
2017-09-26 |
| 9716010 |
Handle wafer |
Jeffrey P. Gambino, Kenneth F. McAvey, Jr., Charles F. Musante, Bruce W. Porth, Anthony K. Stamper |
2017-07-25 |
| 9685362 |
Apparatus and method for centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2017-06-20 |
| 9613921 |
Structure to prevent solder extrusion |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2017-04-04 |
| 9607862 |
Extrusion-resistant solder interconnect structures and methods of forming |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2017-03-28 |
| 9536829 |
Programmable electrical fuse in keep out zone |
Mukta G. Farooq, Ping-Chuan Wang, Lijuan Zhang |
2017-01-03 |
