Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633962 | Plug via formation with grid features in the passivation layer | Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter | 2017-04-25 |
| 9613921 | Structure to prevent solder extrusion | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2017-04-04 |
| 9607862 | Extrusion-resistant solder interconnect structures and methods of forming | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2017-03-28 |