Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842810 | Tiled-stress-alleviating pad structure | Mukta G. Farooq, Krishna R. Tunga | 2017-12-12 |
| 9754905 | Final passivation for wafer level warpage and ULK stress reduction | Krishna R. Tunga | 2017-09-05 |
| 9633962 | Plug via formation with grid features in the passivation layer | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2017-04-25 |