Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9798088 | Barrier structures for underfill blockout regions | Jeffrey P. Gambino, Robert K. Leidy, Christopher D. Muzzy, Eric Turcotte, Thomas E. Lombardi | 2017-10-24 |
| 9741682 | Structures to enable a full intermetallic interconnect | Charles L. Arvin, Christopher D. Muzzy | 2017-08-22 |
| 9679806 | Nanowires for pillar interconnects | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2017-06-13 |
| 9633962 | Plug via formation with grid features in the passivation layer | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy | 2017-04-25 |
| 9633914 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, David B. Stone, Eric W. Tremble | 2017-04-25 |
| 9613921 | Structure to prevent solder extrusion | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2017-04-04 |
| 9607862 | Extrusion-resistant solder interconnect structures and methods of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2017-03-28 |
| 9583451 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2017-02-28 |