Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9633914 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone | 2017-04-25 |
ET
Eric W. Tremble
Overall (2017): #428,304 of 506,227Top 85%
1
Patents 2017