Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853006 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Charles L. Arvin, Harry D. Cox, Eric D. Perfecto | 2017-12-26 |
| 9793232 | All intermetallic compound with stand off feature and method to make | Charles L. Arvin, Luc Guerin, Sylvain E. Ouimet, Sylvain Pharand | 2017-10-17 |
| 9773726 | Three-dimensional integrated circuit integration | Timothy D. Sullivan | 2017-09-26 |