Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853006 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Charles L. Arvin, Eric D. Perfecto, Thomas A. Wassick | 2017-12-26 |
| 9804498 | Filtering lead from photoresist stripping solution | Charles L. Arvin, Arthur G. Merryman, Jennifer D. Schuler | 2017-10-31 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Brian M. Erwin, Jorge A. Lubguban, Eric D. Perfecto, Jennifer D. Schuler | 2017-08-08 |
| 9689084 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Charles L. Arvin, Eric D. Perfecto | 2017-06-27 |
| 9679796 | Anodized metal on carrier wafer | Charles L. Arvin, Jorge A. Lubguban, Jennifer D. Schuler | 2017-06-13 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Katsuyuki Sakuma, Eric D. Perfecto | 2017-03-28 |