| 9853006 |
Semiconductor device contact structure having stacked nickel, copper, and tin layers |
Charles L. Arvin, Eric D. Perfecto, Thomas A. Wassick |
2017-12-26 |
| 9804498 |
Filtering lead from photoresist stripping solution |
Charles L. Arvin, Arthur G. Merryman, Jennifer D. Schuler |
2017-10-31 |
| 9728440 |
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer |
Charles L. Arvin, Brian M. Erwin, Jorge A. Lubguban, Eric D. Perfecto, Jennifer D. Schuler |
2017-08-08 |
| 9689084 |
Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
Charles L. Arvin, Eric D. Perfecto |
2017-06-27 |
| 9679796 |
Anodized metal on carrier wafer |
Charles L. Arvin, Jorge A. Lubguban, Jennifer D. Schuler |
2017-06-13 |
| 9607973 |
Method for establishing interconnects in packages using thin interposers |
Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Katsuyuki Sakuma, Eric D. Perfecto |
2017-03-28 |
