Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673064 | Interposer with lattice construction and embedded conductive metal structures | Jean Audet, Shidong Li | 2017-06-06 |
| 9673177 | Selectively soluble standoffs for chip joining | Mark W. Kapfhammer, David J. Lewison, Thomas E. Lombardi, Thomas Weiss | 2017-06-06 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2017-03-28 |
| 9577361 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Paul F. Fortier, Hilton T. Toy | 2017-02-21 |