Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721870 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Randall J. Werner, Jeffrey A. Zitz | 2017-08-01 |
| 9583408 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Marcus E. Interrante, Yi Pan, Jeffrey A. Zitz | 2017-02-28 |
| 9577361 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Paul F. Fortier | 2017-02-21 |