Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805977 | Integrated circuit structure having through-silicon via and method of forming same | Vijay Sukumaran, Thuy L. Tran-Quinn, John J. Garant | 2017-10-31 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Eric D. Perfecto, Jennifer D. Schuler | 2017-08-08 |
| 9679796 | Anodized metal on carrier wafer | Charles L. Arvin, Harry D. Cox, Jennifer D. Schuler | 2017-06-13 |