Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805977 | Integrated circuit structure having through-silicon via and method of forming same | Vijay Sukumaran, Thuy L. Tran-Quinn, Jorge A. Lubguban | 2017-10-31 |
| 9613842 | Wafer handler and methods of manufacture | Jonathan H. Griffith, Brittany L. Hedrick, Edmund J. Sprogis | 2017-04-04 |