Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851397 | Electromigration testing of interconnect analogues having bottom-connected sensory pins | Fen Chen, Cathryn J. Christiansen, Deborah M. Massey, Michael A. Shinosky | 2017-12-26 |
| 9543219 | Void monitoring device for measurement of wafer temperature variations | Shawn A. Adderly, Samantha D. DiStefano, Mark Esposito, Jeffrey P. Gambino | 2017-01-10 |