Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9851397 | Electromigration testing of interconnect analogues having bottom-connected sensory pins | Cathryn J. Christiansen, Deborah M. Massey, Prakash Periasamy, Michael A. Shinosky | 2017-12-26 | $7,266,000 |
| 9851398 | Via leakage and breakdown testing | Roger A. Dufresne, Charles W. Griffin, Kevin Kolvenbach | 2017-12-26 | $7,266,000 |
| 9812359 | Thru-silicon-via structures | Mukta G. Farooq, Carole D. Graas, Xiao Hu Liu | 2017-11-07 | $8,746,000 |
| 9780031 | Wiring structures | Cathryn J. Christiansen, Roger A. Dufresne, Charles W. Griffin | 2017-10-03 | $10,070,000 |
| 9711464 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2017-07-18 | $2,009,000 |
| 9613853 | Copper wire and dielectric with air gaps | Jeffrey P. Gambino, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2017-04-04 | $2,713,000 |