Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711464 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Fen Chen, Jonathan M. Pratt, Jason P. Ritter, Anna Tilley | 2017-07-18 |
| 9553061 | Wiring bond pad structures | Donald R. Letourneau, Leah J. Bagley, John M. Sutton | 2017-01-24 |