Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852916 | Single platform, multiple cycle spacer deposition and etch | Hao Chen, Chentsau Ying, Srinivas D. Nemani | 2017-12-26 |
| 9815091 | Roll to roll wafer backside particle and contamination removal | Christopher S. Ngai, Huixiong Dai, Ludovic Godet | 2017-11-14 |
| 9777378 | Advanced process flow for high quality FCVD films | Srinivas D. Nemani, Erica Chen, Ludovic Godet, Jun Xue | 2017-10-03 |
| 9773675 | 3D material modification for advanced processing | Ludovic Godet, Srinivas D. Nemani, Erica Chen, Jun Xue, Gary E. Dickerson | 2017-09-26 |
| 9754791 | Selective deposition utilizing masks and directional plasma treatment | Ludovic Godet, Yin Fan, Srinivas D. Nemani | 2017-09-05 |
| 9748148 | Localized stress modulation for overlay and EPE | Huixiong Dai, Srinivas D. Nemani, Ludovic Godet, Christopher Dennis Bencher | 2017-08-29 |
| 9666414 | Process chamber for etching low k and other dielectric films | Dmitry Lubomirsky, Srinivas D. Nemani, Sergey G. Belostotskiy | 2017-05-30 |
| 9620407 | 3D material modification for advanced processing | Ludovic Godet, Srinivas D. Nemani, Erica Chen, Jun Xue, Gary E. Dickerson | 2017-04-11 |
| 9595467 | Air gap formation in interconnection structure by implantation process | Jun Xue, Ludovic Godet, Erica Chen, Srinivas D. Nemani | 2017-03-14 |