Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728450 | Insulating a via in a semiconductor substrate | Mukta G. Farooq, Kevin S. Petrarca, Nicole R. Reardon, Andrew H. Simon | 2017-08-08 |
| 9728506 | Strain engineering devices using partial depth films in through-substrate vias | Mukta G. Farooq, Joyce C. Liu | 2017-08-08 |
| 9673095 | Protected through semiconductor via (TSV) | Mukta G. Farooq, Kevin S. Petrarca, Richard P. Volant | 2017-06-06 |
| 9536784 | Integrated circuit (IC) chips with through silicon vias (TSV) and method of forming the IC | Mukta G. Farooq, Andrew J. Martin | 2017-01-03 |