Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620396 | Laser anneal of buried metallic interconnects including through silicon vias | Oleg Gluschenkov, Joyeeta Nag | 2017-04-11 |
| 9536784 | Integrated circuit (IC) chips with through silicon vias (TSV) and method of forming the IC | Mukta G. Farooq, Jennifer A. Oakley | 2017-01-03 |