Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847290 | Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability | John M. Safran, Jochonia N. Nxumalo, Sami Rosenblatt, Chandrasekharan Kothandaraman | 2017-12-19 |
| 9728506 | Strain engineering devices using partial depth films in through-substrate vias | Mukta G. Farooq, Jennifer A. Oakley | 2017-08-08 |