Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847290 | Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability | John M. Safran, Jochonia N. Nxumalo, Joyce C. Liu, Chandrasekharan Kothandaraman | 2017-12-19 |
| 9837491 | Stacked carbon nanotube multiple threshold device | Rasit Onur Topaloglu | 2017-12-05 |
| 9690927 | Providing an authenticating service of a chip | Srivatsan Chellappa, Subramanian S. Iyer, Toshiaki Kirihata | 2017-06-27 |
| 9624098 | Electromechanical devices and methods for fabrication of the same | James Hone, Changyao Chen | 2017-04-18 |