Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679875 | Reduced volume interconnect for three-dimensional chip stack | Katsuyuki Sakuma, Da-Yuan Shih | 2017-06-13 |
| 9543273 | Reduced volume interconnect for three-dimensional chip stack | Katsuyuki Sakuma, Da-Yuan Shih | 2017-01-10 |