Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851379 | Test probe substrate | Bing Dang, John U. Knickerbocker, Robert E. Trzcinski, Cornelia K. Tsang | 2017-12-26 |
| 9820395 | Low cost hermetic micro-electronics | Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre | 2017-11-14 |
| 9808874 | Flux composition and techniques for use thereof | Kang-Wook Lee, Nathalie Normand, Valerie Oberson | 2017-11-07 |
| 9773751 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2017-09-26 |
| 9761516 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Shriya Kumar | 2017-09-12 |
| 9721864 | Low cost hermetic micro-electronics | Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre | 2017-08-01 |
| 9721919 | Solder bumps formed on wafers using preformed solder balls with different compositions and sizes | — | 2017-08-01 |
| 9704822 | Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates | John U. Knickerbocker | 2017-07-11 |
| 9660116 | Nanowires formed by employing solder nanodots | Keith E. Fogel, Jeehwan Kim, Devendra K. Sadana, Kuen-Ting Shiu | 2017-05-23 |
| 9633925 | Visualization of alignment marks on a chip covered by a pre-applied underfill | Katsuyuki Sakuma, Mukta G. Farooq | 2017-04-25 |
| 9606142 | Test probe substrate | Bing Dang, John U. Knickerbocker, Robert E. Trzcinski, Cornelia K. Tsang | 2017-03-28 |
| 9606308 | Three dimensional self-alignment of flip chip assembly using solder surface tension during solder reflow | Tymon Barwicz, Yves Martin | 2017-03-28 |
| 9579738 | Flux composition and techniques for use thereof | Kang-Wook Lee, Nathalie Normand, Valerie Oberson | 2017-02-28 |