Issued Patents 2017
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851379 | Test probe substrate | Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-12-26 |
| 9820395 | Low cost hermetic micro-electronics | Bing Dang, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-11-14 |
| 9798886 | Bio-medical sensing platform | Bing Dang, Joana Sofia Branquinho Teresa Maria, Sufi Zafar | 2017-10-24 |
| 9773751 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2017-09-26 |
| 9761516 | Via and trench filling using injection molded soldering | Shriya Kumar, Jae-Woong Nah | 2017-09-12 |
| 9748131 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2017-08-29 |
| 9735077 | Heterogeneous miniaturization platform | Qianwen Chen, Li-Wen Hung, Wanki Kim, Kenneth P. Rodbell, Robert L. Wisnieff | 2017-08-15 |
| 9721864 | Low cost hermetic micro-electronics | Bing Dang, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-08-01 |
| 9704822 | Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates | Jae-Woong Nah | 2017-07-11 |
| 9691747 | Manufacture of wafer—panel die package assembly technology | Bing Dang | 2017-06-27 |
| 9684862 | Microelectronic smart tags | Paul S. Andry, Monty M. Denneau, Robert L. Wisnieff | 2017-06-20 |
| 9660525 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff | 2017-05-23 |
| 9648782 | Chip stack structures that implement two-phase cooling with radial flow | Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2017-05-09 |
| 9636783 | Method and apparatus for laser dicing of wafers | Russell A. Budd, Bing Dang | 2017-05-02 |
| 9636782 | Wafer debonding using mid-wavelength infrared radiation ablation | Bing Dang, Cornelia K. Tsang | 2017-05-02 |
| 9606142 | Test probe substrate | Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-03-28 |
| 9601364 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2017-03-21 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | Bing Dang, Eric P. Lewandowski, Cornelia K. Tsang | 2017-03-07 |
| 9568960 | Supercomputer using wafer scale integration | Evan G. Colgan, Monty M. Denneau | 2017-02-14 |