| 9851379 |
Test probe substrate |
Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang |
2017-12-26 |
| 9820395 |
Low cost hermetic micro-electronics |
Bing Dang, Minhua Lu, Jae-Woong Nah, Robert J. Polastre |
2017-11-14 |
| 9798886 |
Bio-medical sensing platform |
Bing Dang, Joana Sofia Branquinho Teresa Maria, Sufi Zafar |
2017-10-24 |
| 9773751 |
Via and trench filling using injection molded soldering |
Shriya Kumar, Jae-Woong Nah |
2017-09-26 |
| 9761516 |
Via and trench filling using injection molded soldering |
Shriya Kumar, Jae-Woong Nah |
2017-09-12 |
| 9748131 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang |
2017-08-29 |
| 9735077 |
Heterogeneous miniaturization platform |
Qianwen Chen, Li-Wen Hung, Wanki Kim, Kenneth P. Rodbell, Robert L. Wisnieff |
2017-08-15 |
| 9721864 |
Low cost hermetic micro-electronics |
Bing Dang, Minhua Lu, Jae-Woong Nah, Robert J. Polastre |
2017-08-01 |
| 9704822 |
Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates |
Jae-Woong Nah |
2017-07-11 |
| 9691747 |
Manufacture of wafer—panel die package assembly technology |
Bing Dang |
2017-06-27 |
| 9684862 |
Microelectronic smart tags |
Paul S. Andry, Monty M. Denneau, Robert L. Wisnieff |
2017-06-20 |
| 9660525 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff |
2017-05-23 |
| 9648782 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang |
2017-05-09 |
| 9636783 |
Method and apparatus for laser dicing of wafers |
Russell A. Budd, Bing Dang |
2017-05-02 |
| 9636782 |
Wafer debonding using mid-wavelength infrared radiation ablation |
Bing Dang, Cornelia K. Tsang |
2017-05-02 |
| 9606142 |
Test probe substrate |
Bing Dang, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang |
2017-03-28 |
| 9601364 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang |
2017-03-21 |
| 9586291 |
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release |
Bing Dang, Eric P. Lewandowski, Cornelia K. Tsang |
2017-03-07 |
| 9568960 |
Supercomputer using wafer scale integration |
Evan G. Colgan, Monty M. Denneau |
2017-02-14 |
