Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773751 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Jae-Woong Nah | 2017-09-26 |
| 9761516 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Jae-Woong Nah | 2017-09-12 |