LH

Li-Wen Hung

IBM: 6 patents #936 of 10,852Top 9%
IN Invensense: 1 patents #48 of 105Top 50%
Overall (2017): #14,840 of 506,227Top 3%
7
Patents 2017

Issued Patents 2017

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
9850406 Adhesive resins for wafer bonding Robert David Allen, Jeffrey D. Gelorme, Ratnam Sooriyakumaran, Linda Karin Sundberg 2017-12-26
9818054 Tag with tunable retro-reflectors Evan G. Colgan, Fuad E. Doany, Reinaldo Vega, Bucknell C. Webb 2017-11-14
9748131 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang 2017-08-29
9735077 Heterogeneous miniaturization platform Qianwen Chen, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff 2017-08-15
9653441 Monolithic integration of a III-V optoelectronic device, a filter and a driving circuit Chia-Yu Chen, Jui-Hsin Lai, Ko-Tao Lee 2017-05-16
9617141 MEMS device and process for RF and low resistance applications Michael Julian Daneman, Martin Lim, Xiang Li 2017-04-11
9601364 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang 2017-03-21