Issued Patents 2003
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Lizhong Sun +1 more | 2003-12-30 |
| 6659849 | Platen with debris control for chemical mechanical planarization | Shijian Li, Jayakumar Gurusamy, Manoocher Birang | 2003-12-09 |
| 6656842 | Barrier layer buffing after Cu CMP | Shijian Li, Ramin Emami, Sen-Hou Ko, John M. White | 2003-12-02 |
| 6645061 | Polishing pad having a grooved pattern for use in chemical mechanical polishing | Doyle E. Bennett, Thomas H. Osterheld, Ginetto Addiego | 2003-11-11 |
| 6638143 | Ion exchange materials for chemical mechanical polishing | Yuchun Wang, Stan Tsai, Kapila Wijekoon, Rajeev Bajaj | 2003-10-28 |
| 6632124 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-10-14 |
| 6629881 | Method and apparatus for controlling slurry delivery during polishing | Rajeev Bajaj, Frank Bose, A. Jason Whitby | 2003-10-07 |
| 6620027 | Method and apparatus for hard pad polishing | Ajoy Zutshi, Rajeev Bajaj, Yutao Ma, Kapila Wijekoon | 2003-09-16 |
| 6602724 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Rajeev Bajaj | 2003-08-05 |
| 6592438 | CMP platen with patterned surface | Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney P. Huey | 2003-07-15 |
| 6589610 | Deposition chamber and method for depositing low dielectric constant films | Shijian Li, Yaxin Wang, Tetsuya Ishikawa, Alan W. Collins | 2003-07-08 |
| 6585563 | In-situ monitoring of linear substrate polishing operations | Manoocher Birang, Shijian Li, Sasson Somekh | 2003-07-01 |
| 6575177 | Semiconductor substrate cleaning system | Brian J. Brown, Anwar Husain | 2003-06-10 |
| 6572453 | Multi-fluid polishing process | Kapila Wijekoon, Stan Tsai, Yuchun Wang, Doyle E. Bennett, Madhavi R. Chandrachood +1 more | 2003-06-03 |
| 6569349 | Additives to CMP slurry to polish dielectric films | Yuchun Wang, Rajeev Bajaj | 2003-05-27 |
| 6561873 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj | 2003-05-13 |
| 6537144 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj | 2003-03-25 |
| 6523553 | Wafer edge cleaning method and apparatus | Brian J. Brown, Michael Sugarman | 2003-02-25 |
| 6520840 | CMP slurry for planarizing metals | Yuchun Wang, Rajeev Bajaj | 2003-02-18 |
| 6509269 | Elimination of pad glazing for Al CMP | Lizhong Sun, Shijian Li | 2003-01-21 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-01-14 |