Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657726 | In situ measurement of slurry distribution | Boguslaw A. Swedek | 2003-12-02 |
| 6638143 | Ion exchange materials for chemical mechanical polishing | Stan Tsai, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-10-28 |
| 6572453 | Multi-fluid polishing process | Kapila Wijekoon, Stan Tsai, Doyle E. Bennett, Fred C. Redeker, Madhavi R. Chandrachood +1 more | 2003-06-03 |
| 6569349 | Additives to CMP slurry to polish dielectric films | Rajeev Bajaj, Fred C. Redeker | 2003-05-27 |
| 6561873 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-05-13 |
| 6537144 | Method and apparatus for enhanced CMP using metals having reductive properties | Stan Tsai, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-03-25 |
| 6520840 | CMP slurry for planarizing metals | Rajeev Bajaj, Fred C. Redeker | 2003-02-18 |