Issued Patents 2003
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker +1 more | 2003-12-30 |
| 6653242 | Solution to metal re-deposition during substrate planarization | Lizhong Sun, Shijian Li, John M. White | 2003-11-25 |
| 6638143 | Ion exchange materials for chemical mechanical polishing | Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-10-28 |
| 6632124 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-10-14 |
| 6613200 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform | Shijian Li, Lizhong Sun | 2003-09-02 |
| 6572453 | Multi-fluid polishing process | Kapila Wijekoon, Yuchun Wang, Doyle E. Bennett, Fred C. Redeker, Madhavi R. Chandrachood +1 more | 2003-06-03 |
| 6561873 | Method and apparatus for enhanced CMP using metals having reductive properties | Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-05-13 |
| 6541384 | Method of initiating cooper CMP process | Lizhong Sun, Shijian Li, John M. White | 2003-04-01 |
| 6537144 | Method and apparatus for enhanced CMP using metals having reductive properties | Yuchun Wang, Kapila Wijekoon, Rajeev Bajaj, Fred C. Redeker | 2003-03-25 |
| 6524167 | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization | Lizhong Sun, Shijian Li | 2003-02-25 |
| 6506097 | Optical monitoring in a two-step chemical mechanical polishing process | Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser +3 more | 2003-01-14 |