Issued Patents 2003
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656842 | Barrier layer buffing after Cu CMP | Shijian Li, Fred C. Redeker, Ramin Emami, Sen-Hou Ko | 2003-12-02 |
| 6653242 | Solution to metal re-deposition during substrate planarization | Lizhong Sun, Stan Tsai, Shijian Li | 2003-11-25 |
| 6626744 | Planarization system with multiple polishing pads | Phillip R. Sommer, Stephen M Fisher, II | 2003-09-30 |
| 6624077 | Integrated circuit waveguide | — | 2003-09-23 |
| 6592439 | Platen for retaining polishing material | Shijian Li, Manoocher Birang, Ramin Emami, Andrew J. Nagengast, Douglas Orcutt Brown +2 more | 2003-07-15 |
| 6577923 | Apparatus and method for robotic alignment of substrates | Shinichi Kurita | 2003-06-10 |
| 6561884 | Web lift system for chemical mechanical planarization | Phillip R. Sommer, Sasson Somekh | 2003-05-13 |
| 6541384 | Method of initiating cooper CMP process | Lizhong Sun, Stan Tsai, Shijian Li | 2003-04-01 |
| 6516816 | Spin-rinse-dryer | Anwar Husain, Brian J. Brown, David G. Andeen, Svetlana Sherman, Michael Sugarman +2 more | 2003-02-11 |
| 6517303 | Substrate transfer shuttle | Norman L. Turner, Robin L. Tiner, Ernst Keller, Shinichi Kurita, Wendell T. Blonigan +1 more | 2003-02-11 |
| 6517048 | Isolation valves | Gary C. Ettinger | 2003-02-11 |