Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669538 | Pad cleaning for a CMP system | Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker +1 more | 2003-12-30 |
| 6653242 | Solution to metal re-deposition during substrate planarization | Stan Tsai, Shijian Li, John M. White | 2003-11-25 |
| 6613200 | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform | Shijian Li, Stan Tsai | 2003-09-02 |
| 6592742 | Electrochemically assisted chemical polish | Shijian Li | 2003-07-15 |
| 6552618 | VCO gain self-calibration for low voltage phase lock-loop applications | Dale H. Nelson | 2003-04-22 |
| 6541384 | Method of initiating cooper CMP process | Stan Tsai, Shijian Li, John M. White | 2003-04-01 |
| 6524167 | Method and composition for the selective removal of residual materials and barrier materials during substrate planarization | Stan Tsai, Shijian Li | 2003-02-25 |
| 6509269 | Elimination of pad glazing for Al CMP | Shijian Li, Fred C. Redeker | 2003-01-21 |
| 6504437 | Low-noise, fast-lock phase-lock loop with “gearshifting” control | Dale H. Nelson | 2003-01-07 |