Issued Patents All Time
Showing 51–75 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417526 | Multiple patterning processes | David L. O'Meara, Eric Chih-Fang Liu, Jodi Grzeskowiak, Akiteru Ko, Anthony Dip | 2022-08-16 |
| 11393694 | Method for planarization of organic films | Robert Brandt, Jeffrey Smith, Jodi Grzeskowiak, Daniel Fulford | 2022-07-19 |
| 11383211 | Point-of-use dynamic concentration delivery system with high flow and high uniformity | Ronald Nasman, Lior Huli, Rodney L. Robison, Norman A. Jacobson, Jr., James Grootegoed | 2022-07-12 |
| 11360388 | Critical dimension correction via calibrated trim dosing | Ronald Nasman, Jeffrey Smith | 2022-06-14 |
| 11342427 | 3D directed self-assembly for nanostructures | Jodi Grzeskowiak, Lars Liebmann, Daniel Chanemougame | 2022-05-24 |
| 11335599 | Self-aligned contacts for 3D logic and memory | Lars Liebmann, Jeffrey Smith, Kandabara Tapily | 2022-05-17 |
| 11335566 | Method for planarization of spin-on and CVD-deposited organic films | Daniel Fulford, Jodi Grzeskowiak | 2022-05-17 |
| 11322401 | Reverse contact and silicide process for three-dimensional semiconductor devices | Jeffrey Smith, Lars Liebmann, Daniel Chanemougame, Hiroki Niimi, Kandabara Tapily +2 more | 2022-05-03 |
| 11264289 | Method for threshold voltage tuning through selective deposition of high-K metal gate (HKMG) film stacks | Jeffrey Smith, Kandabara Tapily, Lars Liebmann, Daniel Chanemougame, Mark I. Gardner +1 more | 2022-03-01 |
| 11264274 | Reverse contact and silicide process for three-dimensional logic devices | Jeffrey Smith, Hiroaki Niimi, Jodi Grzeskowiak, Daniel Chanemougame, Lars Liebmann +2 more | 2022-03-01 |
| 11251200 | Coaxial contacts for 3D logic and memory | Lars Liebmann, Jeffrey Smith, Kandabara Tapily | 2022-02-15 |
| 11251080 | Method of making 3D circuits with integrated stacked 3D metal lines for high density circuits | Mark I. Gardner, H. Jim Fulford | 2022-02-15 |
| 11247309 | Substrate holding apparatus and method for shape metrology | Hoyoung Kang | 2022-02-15 |
| 11217583 | Architecture design of monolithically integrated 3D CMOS logic and memory | Lars Liebmann, Jeffrey Smith, Kandabara Tapily | 2022-01-04 |
| 11201148 | Architecture for monolithic 3D integration of semiconductor devices | Lars Liebmann, Jeffrey Smith | 2021-12-14 |
| 11201051 | Method for layer by layer growth of conformal films | Jodi Grzeskowiak, Daniel Fulford | 2021-12-14 |
| 11171208 | High performance circuit applications using stacked 3D metal lines | H. Jim Fulford, Mark I. Gardner | 2021-11-09 |
| 11133206 | Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking | H. Jim Fulford, Anthony R. Schepis | 2021-09-28 |
| 11114381 | Power distribution network for 3D logic and memory | Lars Liebmann, Jeffrey Smith, Kandabara Tapily | 2021-09-07 |
| 11107682 | Method for patterning a substrate using a layer with multiple materials | — | 2021-08-31 |
| 11101152 | Phase mixture temperature controlled hot plate | — | 2021-08-24 |
| 11069616 | Horizontal programmable conducting bridges between conductive lines | H. Jim Fulford, Mark I. Gardner | 2021-07-20 |
| 11049721 | Method and process for forming memory hole patterns | Toshiharu Wada, Akiteru Ko | 2021-06-29 |
| 11049700 | Atmospheric plasma processing systems and methods for manufacture of microelectronic workpieces | Mirko Vukovic, Brandon Byrns | 2021-06-29 |
| 10998244 | System and method for temperature control in plasma processing system | — | 2021-05-04 |