XC

Xiaomeng Chen

TSMC: 72 patents #433 of 12,232Top 4%
IBM: 18 patents #6,125 of 70,183Top 9%
Huawei: 4 patents #3,171 of 15,535Top 25%
J( Jenkem Technology Co., Ltd. (Tianjin): 2 patents #10 of 20Top 50%
J( Jenkem Technology Co., Ltd. (Beijing): 2 patents #7 of 18Top 40%
Microsoft: 1 patents #24,826 of 40,388Top 65%
EP Envision Digital International Pte.: 1 patents #13 of 37Top 40%
SC Shanghai Envision Digital Co.: 1 patents #13 of 37Top 40%
XC Xiamen Tianma Micro-Electronics Co.: 1 patents #179 of 360Top 50%
AM AMD: 1 patents #5,683 of 9,279Top 65%
📍 Dashulong, NY: #3 of 9 inventorsTop 35%
Overall (All Time): #13,894 of 4,157,543Top 1%
102
Patents All Time

Issued Patents All Time

Showing 51–75 of 102 patents

Patent #TitleCo-InventorsDate
9825040 Semiconductor arrangement with capacitor and method of fabricating the same Chern-Yow Hsu, Ming Chyi Liu, Shih-Chang Liu, Chia-Shiung Tsai, Chen-Jong Wang 2017-11-21
9786628 Air trench in packages incorporating hybrid bonding Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more 2017-10-10
9711555 Dual facing BSI image sensors with wafer level stacking Ping-Yin Liu, Yeur-Luen Tu, Chia-Shiung Tsai, Pin-Nan Tseng 2017-07-18
9646860 Alignment systems and wafer bonding systems and methods Xin-Hua Huang, Ping-Yin Liu, Lan-Lin Chao 2017-05-09
9553096 Semiconductor arrangement with capacitor Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Chen-Jong Wang 2017-01-24
9548376 Method of manufacturing a semiconductor device including a barrier structure Po-Chun Liu, Chi-Ming Chen, Chen-Hao Chiang, Chung-Yi Yu, Chia-Shiung Tsai 2017-01-17
9508722 Semiconductor arrangment with capacitor Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Chen-Jong Wang 2016-11-29
9508659 Method and apparatus to protect a wafer edge Chen-Fa Lu, Yeur-Luen Tu, Shu-Ju Tsai, Cheng-Ta Wu, Chia-Shiung Tsai 2016-11-29
9502396 Air trench in packages incorporating hybrid bonding Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more 2016-11-22
9478632 Method of manufacturing a semiconductor device Po-Chun Liu, Chi-Ming Chen, Chen-Hao Chiang, Chung-Yi Yu, Chia-Shiung Tsai 2016-10-25
9466663 Semiconductor arrangement having capacitor separated from active region Chern-Yow Hsu, Shih-Chang Liu, Chia-Shiung Tsai, Chen-Jong Wang 2016-10-11
9455341 Transistor having a back-barrier layer and method of making the same Chi-Ming Chen, Chih-Wen Hsiung, Po-Chun Liu, Ming-Chang Ching, Chung-Yi Yu 2016-09-27
9446467 Integrate rinse module in hybrid bonding platform Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Xin-Chung Kuang, Yuan-Chih Hsieh +2 more 2016-09-20
9443796 Air trench in packages incorporating hybrid bonding Bruce C. S. Chou, Chen-Jong Wang, Ping-Yin Liu, Jung-Kuo Tu, Tsung-Te Chou +4 more 2016-09-13
9385136 Silicon dot formation by self-assembly method and selective silicon growth for flash memory Chih-Ming Chen, Tsung-Yu Chen, Cheng-Te Lee, Szu-Yu Wang, Chung-Yi Yu +1 more 2016-07-05
9299784 Semiconductor device with non-linear surface Zhiqiang Wu, Shih-Chang Liu, Chien-Hong Chen 2016-03-29
9299768 Semiconductor device with non-linear surface Zhiqiang Wu, Shih-Chang Liu, Chien-Hong Chen 2016-03-29
9281203 Silicon dot formation by direct self-assembly method for flash memory Chih-Ming Chen, Cheng-Te Lee, Szu-Yu Wang, Chung-Yi Yu, Chia-Shiung Tsai 2016-03-08
9257399 3D integrated circuit and methods of forming the same Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao +2 more 2016-02-09
9257636 Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method Chih-Ming Chen, Chern-Yow Hsu, Szu-Yu Wang, Chung-Yi Yu, Chia-Shiung Tsai 2016-02-09
9245991 Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing Po-Chun Liu, Chi-Ming Chen, Chen-Hao Chiang, Chung-Yi Yu, Chia-Shiung Tsai 2016-01-26
9214539 Gallium nitride transistor with a hybrid aluminum oxide layer as a gate dielectric Han-Chin Chiu, King-Yuen Wong, Cheng-Yuan Tsai, Chia-Shiung Tsai 2015-12-15
9170325 Distance measurements between computing devices Zengbin Zhang, David Chiyuan Chu, Thomas Moscibroda, Feng Zhao 2015-10-27
9153717 Backside illuminated photo-sensitive device with gradated buffer layer Yu-Hung Cheng, Yen-Chang Chu, Cheng-Ta Wu, Yeur-Luen Tu, Chia-Shiung Tsai 2015-10-06
9142517 Hybrid bonding mechanisms for semiconductor wafers Ping-Yin Liu, Szu-Ying Chen, Chen-Jong Wang, Chih-Hui Huang, Xin-Hua Huang +3 more 2015-09-22