Issued Patents All Time
Showing 201–225 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8264066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Hai-Ching Chen, Wen-Chih Chiou, Chen-Hua Yu | 2012-09-11 |
| 8232201 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2012-07-31 |
| 8158521 | Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties | Hui-Lin Chang, Chung-Chi Ko, Yun-Chen Lu | 2012-04-17 |
| 8053359 | Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method | Syun-Ming Jang | 2011-11-08 |
| 8030781 | Bond pad structure having dummy plugs and/or patterns formed therearound | Chen-Hua Yu | 2011-10-04 |
| 7968451 | Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Chen-Hua Yu | 2011-06-28 |
| 7964496 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2011-06-21 |
| 7732326 | Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method | Syun-Ming Jang | 2010-06-08 |
| 7723226 | Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio | Chen-Hua Yu, Yung-Cheng Lu, Pei-Ren Jeng, Chia-Cheng Chou, Keng-Chu Lin +2 more | 2010-05-25 |
| 7682963 | Air gap for interconnect application | Hai-Ching Chen, Sunil Kumar Singh, Shau-Lin Shue, Chen-Hua Yu | 2010-03-23 |
| 7564136 | Integration scheme for Cu/low-k interconnects | Ming-Ling Yeh, Chen-Hua Yu, Keng-Chu Lin, Shwang-Ming Cheng | 2009-07-21 |
| 7482265 | UV curing of low-k porous dielectrics | I-I Chen, Shwang-Ming Cheug, Chen-Hua Yu | 2009-01-27 |
| 7465676 | Method for forming dielectric film to improve adhesion of low-k film | Fang Wen Tsai, I-I Chen, Zhen-Cheng Wu, Chih-Lung Lin, Shwang-Ming Jeng +1 more | 2008-12-16 |
| 7456093 | Method for improving a semiconductor device delamination resistance | Pi-Tsung Chen, Keng-Chu Lin, Hui-Lin Chang, Lih-Ping Li, Yung-Cheng Lu +1 more | 2008-11-25 |
| 7429542 | UV treatment for low-k dielectric layer in damascene structure | Chung-Chi Ko, Keng-Chu Lin | 2008-09-30 |
| 7365026 | CxHy sacrificial layer for cu/low-k interconnects | Shwang-Ming Jeng, Ming-Ling Yeh, Keng-Chu Lin | 2008-04-29 |
| 7314828 | Repairing method for low-k dielectric materials | Keng-Chu Lin, Chen-Hua Yu, Ching-Ya Wang, Chia-Cheng Chou, Shwang-Ming Cheng | 2008-01-01 |
| 7250370 | Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties | Hui-Lin Chang, Chung-Chi Ko, Yun-Chen Lu | 2007-07-31 |
| 7250364 | Semiconductor devices with composite etch stop layers and methods of fabrication thereof | Yung-Cheng Lu, Su-Hong Lin, Syun-Ming Jang | 2007-07-31 |
| 7244673 | Integration film scheme for copper / low-k interconnect | Tai-Chun Huang, Chih-Hsiang Yao, Yih-Hsiung Lin, Bi-Trong Chen, Yung-Cheng Lu | 2007-07-17 |
| 7223692 | Multi-level semiconductor device with capping layer for improved adhesion | Keng-Chu Lin, Syun-Ming Jang | 2007-05-29 |
| 7135402 | Sealing pores of low-k dielectrics using CxHy | Keng-Chu Lin, Shwang-Ming Cheng, Ming-Ling Yeh | 2006-11-14 |
| 7129164 | Method for forming a multi-layer low-K dual damascene | Hui-Lin Chang, Yung-Cheng Lu, Li Li, Chih-Hsien Lin | 2006-10-31 |
| 7109119 | Scum solution for chemically amplified resist patterning in cu/low k dual damascene | Syun-Ming Jang | 2006-09-19 |
| 7042049 | Composite etching stop in semiconductor process integration | Lain-Jong Li, Shwang-Ming Jeng, Syun-Ming Jang, Jun-Lung Huang, Jeng-Cheng Liu | 2006-05-09 |