Issued Patents All Time
Showing 176–200 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8975189 | Method of forming fine patterns | Chih Wei Lu, Chung-Ju Lee | 2015-03-10 |
| 8976833 | Light coupling device and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Hai-Ching Chen | 2015-03-10 |
| 8922900 | Optical element structure and optical element fabricating process for the same | Chun-Hao Tseng, Ying-Hao Kuo, Hai-Ching Chen | 2014-12-30 |
| 8901007 | Addition of carboxyl groups plasma during etching for interconnect reliability enhancement | Cheng-Hsiung Tsai, Chung-Ju Lee, Sunil Kumar Singh | 2014-12-02 |
| 8894869 | Lithography process using directed self assembly | Yu-Sheng Chang, Tsung-Jung Tsai, Chung-Ju Lee | 2014-11-25 |
| 8889544 | Dielectric protection layer as a chemical-mechanical polishing stop layer | Yung-Hsu Wu, Hsin-Hsien Lu, Shau-Lin Shue | 2014-11-18 |
| 8890321 | Method of semiconducotr integrated circuit fabrication | Hsin-Chieh Yao, Cheng-Hsiung Tsai, Chung-Ju Lee | 2014-11-18 |
| 8866297 | Air-gap formation in interconnect structures | Cheng-Hsiung Tsai, Chung-Ju Lee | 2014-10-21 |
| 8847396 | Semiconductor integrated circuit and fabricating the same | Hsin-Yen Huang, Yu-Sheng Chang, Hai-Ching Chen | 2014-09-30 |
| 8835304 | Method of semiconductor integrated circuit fabrication | Chih Wei Lu, Chung-Ju Lee, Hsiang-Huan Lee | 2014-09-16 |
| 8836127 | Interconnect with flexible dielectric layer | Ching-Yu Lo, Bo-Jiun Lin, Hai-Ching Chen, Shau-Lin Shue, Chen-Hua Yu | 2014-09-16 |
| 8828484 | Self-alignment due to wettability difference of an interface | Jay Lai, Ying-Hao Kuo, Hai-Ching Chen | 2014-09-09 |
| 8735278 | Copper etch scheme for copper interconnect structure | Ming-Han Lee, Hai-Ching Chen, Hsiang-Huan Lee, Chi-Lin Teng | 2014-05-27 |
| 8736014 | High mechanical strength additives for porous ultra low-k material | Bo-Jiun Lin, Ching-Yu Lo, Hai-Ching Chen, Chen-Hua Yu | 2014-05-27 |
| 8728936 | Copper etching integration scheme | Chih Wei Lu, Chung-Ju Lee, Hsiang-Huan Lee | 2014-05-20 |
| 8729703 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2014-05-20 |
| 8710660 | Hybrid interconnect scheme including aluminum metal line in low-k dielectric | Chen-Hua Yu | 2014-04-29 |
| 8664743 | Air-gap formation in interconnect structures | Cheng-Hsiung Tsai, Chung-Ju Lee | 2014-03-04 |
| 8652962 | Etch damage and ESL free dual damascene metal interconnect | Sunil Kumar Singh, Chung-Ju Lee | 2014-02-18 |
| 8629056 | Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Chen-Hua Yu | 2014-01-14 |
| 8629066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Hai-Ching Chen, Wen-Chih Chiou, Chen-Hua Yu | 2014-01-14 |
| 8446012 | Interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2013-05-21 |
| 8440564 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2013-05-14 |
| 8405192 | Low dielectric constant material | Hsin-Yen Huang, Ching-Yu Lo, Hai-Ching Chen | 2013-03-26 |
| 8348719 | Polisher for chemical mechanical planarization | Hsin-Hsien Lu, Liang-Guang Chen, Shau-Lin Shue | 2013-01-08 |