Issued Patents All Time
Showing 126–150 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9607850 | Self-aligned double spacer patterning process | Cheng-Hsiung Tsai, Yung-Hsu Wu, Tsung-Min Huang, Chung-Ju Lee, Shau-Lin Shue | 2017-03-28 |
| 9589890 | Method for interconnect scheme | Hsin-Chieh Yao, Carlos H. Diaz, Cheng-Hsiung Tsai, Chung-Ju Lee, Chien-Hua Huang +3 more | 2017-03-07 |
| 9576814 | Method of spacer patterning to form a target integrated circuit pattern | Chieh-Han Wu, Cheng-Hsiung Tsai, Chung-Ju Lee, Ming-Feng Shieh, Ru-Gun Liu +1 more | 2017-02-21 |
| 9568677 | Waveguide structure and method for fabricating the same | Chun-Hao Tseng, Ying-Hao Kuo, Hai-Ching Chen | 2017-02-14 |
| 9570305 | Self-aligned double patterning | Yu-Sheng Chang, Chung-Ju Lee | 2017-02-14 |
| 9564397 | Interconnect structure and method of forming the same | Cheng-Hsiung Tsai, Chung-Ju Lee, Hai-Ching Chen, Shau-Lin Shue | 2017-02-07 |
| 9502261 | Spacer etching process for integrated circuit design | Ru-Gun Liu, Cheng-Hsiung Tsai, Chung-Ju Lee, Chih-Ming Lai, Chia-Ying Lee +6 more | 2016-11-22 |
| 9490148 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Feng Cheng, Hai-Ching Chen | 2016-11-08 |
| 9490133 | Etching apparatus | Wan-Yu Lee, Ying-Hao Kuo, Hai-Ching Chen | 2016-11-08 |
| 9484257 | Semiconductor devices and methods of manufacture thereof | Hsin-Chieh Yao, Chung-Ju Lee, Shau-Lin Shue | 2016-11-01 |
| 9484211 | Etchant and etching process | Wan-Yu Lee, Ying-Hao Kuo, Hai-Ching Chen | 2016-11-01 |
| 9478430 | Method of semiconductor integrated circuit fabrication | Hsin-Chieh Yao, Cheng-Hsiung Tsai, Chung-Ju Lee | 2016-10-25 |
| 9478939 | Light coupling device and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Hai-Ching Chen | 2016-10-25 |
| 9466486 | Method for integrated circuit patterning | Ming-Feng Shieh, Ru-Gun Liu, Hung-Chang Hsieh, Chung-Ju Lee, Shau-Lin Shue | 2016-10-11 |
| 9460988 | Interconnect structures | Chen-Hua Yu, Hai-Ching Chen | 2016-10-04 |
| 9431297 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Cheng-Hsiung Tsai, Yu-Sheng Chang, Chia-Tien Wu, Chung-Ju Lee +4 more | 2016-08-30 |
| 9412651 | Air-gap formation in interconnect structures | Cheng-Hsiung Tsai, Chung-Ju Lee | 2016-08-09 |
| 9405063 | Integrated metal grating | Jui Hsieh Lai, Hai-Ching Chen, Ying-Hao Kuo | 2016-08-02 |
| 9383513 | Waveguide structure | Wan-Yu Lee, Ying-Hao Kuo | 2016-07-05 |
| 9372316 | Silicon interface for dielectric slab waveguide | Chewn-Pu Jou | 2016-06-21 |
| 9373579 | Protecting layer in a semiconductor structure | Chi-Lin Teng, Hai-Ching Chen | 2016-06-21 |
| 9373586 | Copper etching integration scheme | Chih Wei Lu, Chung-Ju Lee, Hsiang-Huan Lee | 2016-06-21 |
| 9362164 | Hybrid interconnect scheme and methods for forming the same | Chen-Hua Yu | 2016-06-07 |
| 9349595 | Methods of manufacturing semiconductor devices | Cheng-Hsiung Tsai, Chung-Ju Lee, Hsin-Chieh Yao | 2016-05-24 |
| 9335473 | Package structure and methods of forming same | Jui Hsieh Lai, Ying-Hao Kuo, Hai-Ching Chen | 2016-05-10 |