Issued Patents All Time
Showing 226–250 of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015136 | Method for preventing formation of photoresist scum | Shwang-Min Jeng, Syun-Ming Jang | 2006-03-21 |
| 6962869 | SiOCH low k surface protection layer formation by CxHy gas plasma treatment | Hsin-Hsien Lu, Lih-Ping Li, Chung-Chi Ko, Aaron Song, Syun-Ming Jang | 2005-11-08 |
| 6924242 | SiOC properties and its uniformity in bulk for damascene applications | Syun-Ming Jang, Chung-Chi Ko, Lih-Ping Li, Al-Sen Liu | 2005-08-02 |
| 6887790 | Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity | Bi-Trong Chen, Ying-Ho Chen | 2005-05-03 |
| 6884659 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Lih-Ping Li | 2005-04-26 |
| 6867135 | Via bottom copper/barrier interface improvement to resolve via electromigration and stress migration | Syun-Ming Jang | 2005-03-15 |
| 6861754 | Semiconductor device with anchor type seal ring | Kang-Cheng Lin | 2005-03-01 |
| 6812043 | Method for forming a carbon doped oxide low-k insulating layer | Chung-Chi Ko, Lih-Ping Li, Syun-Ming Jang | 2004-11-02 |
| 6753260 | Composite etching stop in semiconductor process integration | Lain-Jong Li, Shwang-Ming Jeng, Syun-Ming Jang, Jun-Lung Huang, Jeng-Cheng Liu | 2004-06-22 |
| 6734079 | Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein | Chi-Feng Huang, Shyh-Chyi Wang, Chih-Hsien Lin, Chun-Hon Chen, Syun-Ming Jang | 2004-05-11 |
| 6734101 | Solution to the problem of copper hillocks | Jeng Shwang-Ming, Syun-Ming Jang, Chen-Hua Yu, Kuen-Chyr Lee | 2004-05-11 |
| 6677251 | Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion | Hsin-Hsien Lu, Aaron Song, Syun-Ming Jang | 2004-01-13 |
| 6667249 | Minimizing coating defects in low dielectric constant films | Yu-Hui Chen, Yao-Yi Cheng | 2003-12-23 |
| 6623654 | Thin interface layer to improve copper etch stop | Bi-Trong Chen, Lain-Jong Li, Syun-Ming Jang, Shu E Ku, Lih-Ping Li | 2003-09-23 |
| 6620745 | Method for forming a blocking layer | Syan-Mang Jang, Lain-Jong Li, Shwang-Ming Jeng | 2003-09-16 |
| 6602780 | Method for protecting sidewalls of etched openings to prevent via poisoning | Tsu Shih, Yung-Cheng Lu, Lih-Ping Li, Chung-Chi Ko | 2003-08-05 |
| 6518183 | Hillock inhibiting method for forming a passivated copper containing conductor layer | Weng Chang, Ying-Ho Chen, Syun-Ming Jang | 2003-02-11 |
| 6472312 | Methods for inhibiting microelectronic damascene processing induced low dielectric constant dielectric layer physical degradation | Syun-Ming Jang, Weng Chang | 2002-10-29 |
| 6455417 | Method for forming damascene structure employing bi-layer carbon doped silicon nitride/carbon doped silicon oxide etch stop layer | Syun-Ming Jang | 2002-09-24 |
| 6424038 | Low dielectric constant microelectronic conductor structure with enhanced adhesion and attenuated electrical leakage | Syun-Ming Jang | 2002-07-23 |
| 6407013 | Soft plasma oxidizing plasma method for forming carbon doped silicon containing dielectric layer with enhanced adhesive properties | Lain-Jong Li, Cheng-Chung Lin, Syun-Ming Jang | 2002-06-18 |
| 6358841 | Method of copper CMP on low dielectric constant HSQ material | Syun-Ming Jang | 2002-03-19 |
| 6350694 | Reducing CMP scratch, dishing and erosion by post CMP etch back method for low-k materials | Weng Chang, Syun-Ming Jang | 2002-02-26 |
| 6248665 | Delamination improvement between Cu and dielectrics for damascene process | Syun-Ming Jang | 2001-06-19 |
| 6181013 | Method for selective growth of Cu3Ge or Cu5Si for passivation of damascene copper structures and device manufactured thereby | Chung-Shi Liu, Chen-Hua Yu, Syun-Ming Jang | 2001-01-30 |