Issued Patents All Time
Showing 76–100 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770437 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng | 2020-09-08 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2020-09-01 |
| 10741537 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2020-08-11 |
| 10741404 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-08-11 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2020-07-14 |
| 10700032 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2020-06-30 |
| 10665473 | Package structure and method of fabricating the same | Chia-Hsiang Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Arunima Banerjee | 2020-05-26 |
| 10636747 | Semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng, De-Dui Liao | 2020-04-28 |
| 10546830 | Chip package structure | Shin-Puu Jeng, Feng-Cheng Hsu | 2020-01-28 |
| 10535597 | Semiconductor structure and manufacturing method thereof | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-01-14 |
| 10535632 | Semiconductor package structure and method of manufacturing the same | Shin-Puu Jeng, Feng-Cheng Hsu | 2020-01-14 |
| 10515827 | Method for forming chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Techi Wong | 2019-12-24 |
| 10515875 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2019-12-24 |
| 10504752 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2019-12-10 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-12-10 |
| 10475731 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2019-11-12 |
| 10373923 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2019-08-06 |
| 10283474 | Chip package structure and method for forming the same | Shin-Puu Jeng, Feng-Cheng Hsu | 2019-05-07 |
| 10276484 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2019-04-30 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shin-Puu Jeng, Shu-Shen Yeh +1 more | 2019-04-30 |
| 10269736 | Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad | Yu-Ting Huang | 2019-04-23 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2019-04-23 |
| 10163860 | Semiconductor package structure | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2018-12-25 |
| 10050024 | Semiconductor package and manufacturing method of the same | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng | 2018-08-14 |
| 9997471 | Semiconductor package structure and manufacturing method thereof | Jui-Pin Hung, Feng-Cheng Hsu, Shin-Puu Jeng, De-Dui Liao | 2018-06-12 |