Issued Patents All Time
Showing 101–122 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960106 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Der-Chyang Yeh, Chiung-Han Yeh | 2018-05-01 |
| 9922160 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2018-03-20 |
| 9922903 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2018-03-20 |
| 9911629 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng | 2018-03-06 |
| 9831200 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2017-11-28 |
| 9632114 | Digital closed-loop fiber optical current sensor | Xiangxun Chen, Jianbo Guo, Ping Jing, Shujie Yin, Zhanyuan Liu | 2017-04-25 |
| 9601372 | Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad | Yu-Ting Huang | 2017-03-21 |
| 9460987 | Interconnect structure for package-on-package devices and a method of fabricating | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2016-10-04 |
| 9379069 | Semiconductor arrangement comprising transmission line surrounded by magnetic layer | Huan-Neng Chen, Jun-De Jin, Chewn-Pu Jou | 2016-06-28 |
| 9275923 | Band pass filter for 2.5D/3D integrated circuit applications | Feng-Wei Kuo, Huan-Neng Chen, Chewn-Pu Jou, Der-Chyang Yeh | 2016-03-01 |
| 9245833 | Metal pads with openings in integrated circuits | Yu-Ting Huang | 2016-01-26 |
| 9048222 | Method of fabricating interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Chiung-Han Yeh +1 more | 2015-06-02 |
| 9040381 | Packages with passive devices and methods of forming the same | Chen-Hua Yu, Shang-Yun Hou, Der-Chyang Yeh, Chiung-Han Yeh, Yi-Jou Lin | 2015-05-26 |
| 8937389 | Semiconductor devices comprising GSG interconnect structures | Christianto Chih-Ching Liu, Der-Chyang Yeh, Shang-Yun Hou, Shin-Puu Jeng | 2015-01-20 |
| 8878369 | Low power/high speed TSV interface design | Chung-Hui Chen, Jaw-Juinn Horng, Der-Chyang Yeh | 2014-11-04 |
| 8809996 | Package with passive devices and method of forming the same | Der-Chyang Yeh, Li-Hsien Huang | 2014-08-19 |
| 8680647 | Packages with passive devices and methods of forming the same | Chen-Hua Yu, Shang-Yun Hou, Der-Chyang Yeh, Chiung-Han Yeh, Yi-Jou Lin | 2014-03-25 |
| 8390078 | Quadrangle MOS transistors | Chin-Chou Liu | 2013-03-05 |
| 8324713 | Profile design for lateral-vertical bipolar junction transistor | Chih-Ping Chao, Chih-Sheng Chang, Hua-Chou Tseng | 2012-12-04 |
| 8115280 | Four-terminal gate-controlled LVBJTs | Chia-Chung Chen, Chin-Wei Kuo, Sally Liu | 2012-02-14 |
| 7701038 | High-gain vertex lateral bipolar junction transistor | Chih-Ping Chao, Chih-Sheng Chang | 2010-04-20 |
| 6903644 | Inductor device having improved quality factor | Sung-Hsiung Wang, Heng-Ming Hsu, Jui-Feng Kuan, Chih-Ping Chao, Chih-Hsien Lin | 2005-06-07 |