Issued Patents All Time
Showing 51–75 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10720388 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2020-07-21 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10651675 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Hung-Yi Kuo | 2020-05-12 |
| 10530175 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo | 2020-01-07 |
| 10510478 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2019-12-17 |
| 10497646 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu | 2019-12-03 |
| 10475755 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2019-11-12 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2019-04-23 |
| 10269676 | Thermally enhanced package-on-package (PoP) | Tsung-Hsien Chiang, Chen-Shien Chen | 2019-04-23 |
| 10269702 | Info coil structure and methods of manufacturing same | Chen-Hua Yu, Tsung-Hsien Chiang, Hao-Yi Tsai, Hung-Yi Kuo | 2019-04-23 |
| 10269773 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2019-04-23 |
| 10163780 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2018-12-25 |
| 10128203 | Fan-out package structure, antenna system and associated method | Wei-Ting Chen, Tzu-Chun Tang, In-Tsang Lin, Vincent Chen, Chuei-Tang Wang +1 more | 2018-11-13 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-10-30 |
| 10097030 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Hung-Yi Kuo | 2018-10-09 |
| 10074472 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Hao-Yi Tsai, Hung-Yi Kuo +1 more | 2018-09-11 |
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2018-07-31 |
| 9991218 | Connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-06-05 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-04-24 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Tsung-Ding Wang, Chen-Shien Chen | 2018-01-02 |
| 9786621 | Elongated bump structures in package structure | Chita Chuang, Chen-Shien Chen, Yao-Chun Chuang | 2017-10-10 |
| 9761522 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2017-09-12 |
| 9748216 | Apparatus and method for a component package | Chih-Hua Chen, Chen-Shien Chen, Ching-Wen Hsiao | 2017-08-29 |
| 9741589 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Chen-Shien Chen | 2017-08-22 |