Issued Patents All Time
Showing 26–50 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600431 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Hung-Yi Kuo +1 more | 2023-03-07 |
| 11532425 | Hexagonal semiconductor package structure | Tzu-Sung Huang, Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo | 2022-12-20 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +1 more | 2022-12-06 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11410932 | Semiconductor device and method of manufacturing the same | Cheng-Chieh Hsieh, Hao-Yi Tsai | 2022-08-09 |
| 11282785 | Wireless charging package with chip integrated in coil center | Chen-Hua Yu, Chiang-Jui Chu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2022-03-22 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Cheng-Chieh Hsieh, Hung-Yi Kuo, Hao-Yi Tsai | 2022-02-15 |
| 11251644 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Hao-Yi Tsai, Tzu-Sung Huang, Hung-Yi Kuo | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2022-02-08 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2022-01-18 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Hao-Yi Tsai, Tsung-Hsien Chiang, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
| 11075176 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai | 2021-07-27 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2021-05-11 |
| 10971477 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-06 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2021-03-16 |
| 10879221 | Package-on-package structure | Chun-Ti Lu, Chih-Hua Chen, Hao-Yi Tsai, Yen-Liang Lin | 2020-12-29 |
| 10867911 | InFO coil structure and methods of manufacturing same | Chen-Hua Yu, Tsung-Hsien Chiang, Hao-Yi Tsai, Hung-Yi Kuo | 2020-12-15 |
| 10867810 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Chen-Shien Chen | 2020-12-15 |
| 10847304 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Hung-Yi Kuo +1 more | 2020-11-24 |
| 10825602 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2020-11-03 |
| 10790244 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai | 2020-09-29 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2020-09-22 |
| 10784223 | Elongated bump structures in package structure | Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2020-09-22 |
| 10763229 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2020-09-01 |
| 10748785 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Chen-Shien Chen | 2020-08-18 |