Issued Patents All Time
Showing 326–350 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8558351 | Alignment for backside illumination sensor | Dun-Nian Yaung, Shou-Gwo Wuu | 2013-10-15 |
| 8531565 | Front side implanted guard ring structure for backside illuminated image sensor | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2013-09-10 |
| 8513587 | Image sensor with anti-reflection layer and method of manufacturing the same | Tzu-Jui Wang, Hsiao-Hui Tseng, Wei-Cheng Hsu, Dun-Nian Yaung | 2013-08-20 |
| 8502389 | CMOS image sensor and method for forming the same | Cheng-Ying Ho, Dun-Nian Yaung, Jeng-Shyan Lin, Wen-De Wang, Shih Pei Chou | 2013-08-06 |
| 8460979 | Method of fabricating a backside illuminated image sensor | Jhy-Ming Hung, Dun-Nian Yaung | 2013-06-11 |
| 8461021 | Multiple seal ring structure | Dun-Nian Yaung, Jen-Shyan Lin, Wen-De Wang, Shu-Ting Tsai | 2013-06-11 |
| 8455971 | Apparatus and method for improving charge transfer in backside illuminated image sensor | Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2013-06-04 |
| 8440540 | Method for doping a selected portion of a device | Han-Chi Liu, Dun-Nian Yaung, Yuan-Hung Liu | 2013-05-14 |
| 8440495 | Method for reducing crosstalk in image sensors using implant technology | Chin-Hong Cheng, Chien-Hsien Tseng, Alex Hsu, Feng-Jia Shiu, Shou-Gwo Wuu | 2013-05-14 |
| 8435824 | Backside illumination sensor having a bonding pad structure and method of making the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jeng-Shyan Lin, Wen-De Wang, Yueh-Chiou Lin | 2013-05-07 |
| 8405182 | Back side illuminated image sensor with improved stress immunity | Keng-Yu Chou, Dun-Nian Yaung, Pao-Tung Cheng, Wen-De Wang, Chun-Chieh Chuang +1 more | 2013-03-26 |
| 8390089 | Image sensor with deep trench isolation structure | Szu-Ying Chen, Chun-Chieh Chuang, Dun-Nian Yaung | 2013-03-05 |
| 8377733 | Antireflective layer for backside illuminated image sensor and method of manufacturing same | Chih-Hui Huang, Cheng-Yuan Tsai, Yeur-Luen Tu, Chia-Shiung Tsai, Dun-Nian Yaung | 2013-02-19 |
| 8338917 | Multiple seal ring structure | Dun-Nian Yaung, Jeng-Shyan Lin, Wen-De Wang, Shu-Ting Tsai | 2012-12-25 |
| 8293122 | Dual metal for a backside package of backside illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Jyh-Ming Hung, Pao-Tung Chen | 2012-10-23 |
| 8283754 | Seal ring structure with metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2012-10-09 |
| 8278152 | Bonding process for CMOS image sensor | Dun-Nian Yaung, Chen-Cheng Kuo, Chen-Shien Chen, Shou-Gwo Wuu | 2012-10-02 |
| 8227899 | Alignment for backside illumination sensor | Dun-Nian Yaung, Shou-Gwo Wuu | 2012-07-24 |
| 8227288 | Image sensor and method of fabricating same | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2012-07-24 |
| 8222710 | Sensor structure for optical performance enhancement | Jhy-Ming Hung, Dun-Nian Yaung, Chun-Chieh Chuang | 2012-07-17 |
| 8202791 | Method for generating two dimensions for different implant energies | Chun-Chieh Chuang, Dun-Nian Yaung, Jeng-Shyan Lin, Wen-De Wang | 2012-06-19 |
| 8164124 | Photodiode with multi-epi films for image sensor | Dun-Nian Yaung, Jyh-Ming Hung, Wen-De Wang, Chun-Chieh Chuang | 2012-04-24 |
| 7968424 | Method of implantation | Jeng-Shyan Lin, Dun-Nian Yaung, Chun-Chieh Chuang, Pao-Tung Chen, Wen-De Wang +1 more | 2011-06-28 |
| 7588993 | Alignment for backside illumination sensor | Dun-Nian Yaung, Shou-Gwo Wuu | 2009-09-15 |
| 6995085 | Underlayer protection for the dual damascene etching | Lawrence Lui, Chia-Shia Tsai, Chao-Cheng Chen | 2006-02-07 |