Issued Patents All Time
Showing 276–300 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136302 | Apparatus for vertically integrated backside illuminated image sensors | Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Ping-Yin Liu, Lan-Lin Chao | 2015-09-15 |
| 9123615 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Szu-Ying Chen, Wen-De Wang +1 more | 2015-09-01 |
| 9123617 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2015-09-01 |
| 9117879 | Semiconductor device and manufacturing method thereof | Cheng-Ying Ho, Wen-De Wang, Dun-Nian Yaung | 2015-08-25 |
| 9076715 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2015-07-07 |
| 9076708 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2015-07-07 |
| 9064989 | Photo diode and method of forming the same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2015-06-23 |
| 9064986 | Photo diode and method of forming the same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Yuichiro Yamashita +1 more | 2015-06-23 |
| 9059061 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2015-06-16 |
| 9048162 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2015-06-02 |
| 9040891 | Image device and methods of forming the same | U-Ting Chen, Dun-Nian Yaung, Yu-Hao Shih, Chih-Chien Wang, Shih Pei Chou +2 more | 2015-05-26 |
| 9041206 | Interconnect structure and method | Shu-Ting Tsai, Dun-Nian Yaung, Cheng-Jong Wang, Feng-Chi Hung, Tzu-Hsuan Hsu +3 more | 2015-05-26 |
| 9041841 | Image sensor having enhanced backside illumination quantum efficiency | Yin-Kai Liao, Han-Chi Liu, Yuan-Hung Liu, Dun-Nian Yaung | 2015-05-26 |
| 9035445 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2015-05-19 |
| 9029183 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Tzu-Jui Wang, Dun-Nian Yaung | 2015-05-12 |
| 9013022 | Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2015-04-21 |
| 8987855 | Pad structures formed in double openings in dielectric layers | Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2015-03-24 |
| 8981510 | Ridge structure for back side illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Keng-Yu Chou, Wen-De Wang, Pao-Tung Chen | 2015-03-17 |
| 8969991 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2015-03-03 |
| 8962375 | Method of making a reflective shield | Yu-Hao Shih, Szu-Ying Chen, Hsing-Lung Chen, Dun-Nian Yaung, Volume Chien | 2015-02-24 |
| 8957358 | CMOS image sensor chips with stacked scheme and methods for forming the same | Meng-Hsun Wan, Szu-Ying Chen, Dun-Nian Yaung | 2015-02-17 |
| 8952497 | Scribe lines in wafers | U-Ting Chen, Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Shuang-Ji Tsai | 2015-02-10 |
| 8946784 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen | 2015-02-03 |
| 8946849 | BSI image sensor chips with separated color filters and methods for forming the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jeng-Shyan Lin, Feng-Chi Hung | 2015-02-03 |
| 8941204 | Apparatus and method for reducing cross talk in image sensors | Jeng-Shyan Lin, Dun-Nian Yaung, Tzu-Hsuan Hsu, Shuang-Ji Tsai, Min-Feng Kao | 2015-01-27 |