Issued Patents All Time
Showing 226–250 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570497 | Back side illuminated image sensor having isolated bonding pads | Shuang-Ji Tsai, Dun-Nian Yaung, Wen-De Wang, Hsiao-Hui Tseng | 2017-02-14 |
| 9559244 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2017-01-31 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2017-01-24 |
| 9536915 | Image sensor with embedded infrared filter layer | Keng-Yu Chou, Kazuaki Hashimoto, Jhy-Jyi Sze, Wei-Chieh Chiang, Pao-Tung Chen | 2017-01-03 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou +2 more | 2017-01-03 |
| 9530811 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2016-12-27 |
| 9525003 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2016-12-20 |
| 9520433 | Method of fabricating deep trench isolation structure in image sensor and device thereof | Hsin-Hung Chen, Dun-Nian Yaung, Alexander Kalnitsky, Wen-De Wang | 2016-12-13 |
| 9455288 | Image sensor structure to reduce cross-talk and improve quantum efficiency | Shuang-Ji Tsai, Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Wen-De Wang | 2016-09-27 |
| 9443836 | Forming pixel units of image sensors through bonding two chips | Szu-Ying Chen, Meng-Hsun Wan, Tzu-Jui Wang, Dun-Nian Yaung | 2016-09-13 |
| 9412725 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Dun-Nian Yaung +1 more | 2016-08-09 |
| 9412719 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, U-Ting Chen, Shih Pei Chou | 2016-08-09 |
| 9406711 | Apparatus and method for backside illuminated image sensors | Szu-Ying Chen, Tzu-Jui Wang, Dun-Nian Yaung, Ping-Yin Liu, Lan-Lin Chao | 2016-08-02 |
| 9406712 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Dun-Nian Yaung, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2016-08-02 |
| 9406715 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Feng-Chi Hung, Dun-Nian Yaung | 2016-08-02 |
| 9401380 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2016-07-26 |
| 9373657 | System and method for fabricating a 3D image sensor structure | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang | 2016-06-21 |
| 9374538 | Image sensor with embedded infrared filter layer | Keng-Yu Chou, Kazuaki Hashimoto, Jhy-Jyi Sze, Wei-Chieh Chiang, Pao-Tung Chen | 2016-06-21 |
| 9368545 | Elevated photodiodes with crosstalk isolation | Yi-Shin Chu, Cheng-Tao Lin, Meng-Hsun Wan, Szu-Ying Chen, Dun-Nian Yaung | 2016-06-14 |
| 9362329 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2016-06-07 |
| 9356058 | Backside structure for BSI image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2016-05-31 |
| 9355888 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2016-05-31 |
| 9356066 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2016-05-31 |
| 9356069 | Photo diode and method of forming the same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2016-05-31 |
| 9337235 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen | 2016-05-10 |