Issued Patents All Time
Showing 176–200 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090353 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2018-10-02 |
| 10090349 | CMOS image sensor chips with stacked scheme and methods for forming the same | Meng-Hsun Wan, Szu-Ying Chen, Dun-Nian Yaung | 2018-10-02 |
| 10062728 | Image sensor device and method | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung, Shuang-Ji Tsai | 2018-08-28 |
| 10062721 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2018-08-28 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2018-08-21 |
| 10049981 | Through via structure, semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Dun-Nian Yaung | 2018-08-14 |
| 10008532 | Implant isolated devices and method for forming the same | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2018-06-26 |
| 9978805 | Method for manufacturing image sensor structure having wide contact | Tzu-Jui Wang, Dun-Nian Yaung, Tzu-Hsuan Hsu, Yuichiro Yamashita | 2018-05-22 |
| 9935147 | Deep trench isolation structure in image sensor device | Hsin-Hung Chen, Dun-Nian Yaung, Alexander Kalnitsky, Wen-De Wang | 2018-04-03 |
| 9929198 | Infrared image sensor | Keng-Yu Chou, Kazuaki Hashimoto, Jhy-Jyi Sze, Wei-Chieh Chiang, Pao-Tung Chen | 2018-03-27 |
| 9923011 | Semiconductor device structure with stacked semiconductor dies | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2018-03-20 |
| 9917123 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Tzu-Jui Wang, Dun-Nian Yaung | 2018-03-13 |
| 9905426 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung | 2018-02-27 |
| 9887234 | CMOS image sensor and method for forming the same | Min-Feng Kao, Wei-Cheng Hsu, Tzu-Jui Wang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu +2 more | 2018-02-06 |
| 9875989 | Semiconductor device structure | Min-Feng Kao, Dun-Nian Yaung, Jeng-Shyan Lin, Hsun-Ying Huang | 2018-01-23 |
| 9865645 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-01-09 |
| 9859322 | Methods and apparatus for glass removal in CMOS image sensors | Pao-Tung Chen, Szu-Ying Chen, Dun-Nian Yaung | 2018-01-02 |
| 9847368 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Szu-Ying Chen, Wen-De Wang +1 more | 2017-12-19 |
| 9837464 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-12-05 |
| 9818735 | Method of manufacturing a semiconductor device | Cheng-Ying Ho, Wen-De Wang, Dun-Nian Yaung | 2017-11-14 |
| 9812487 | Structure and method for 3D image sensor | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2017-11-07 |
| 9812409 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Hsin-Hui Lee, Wen-De Wang, Shu-Ting Tsai | 2017-11-07 |
| 9812482 | Frontside illuminated (FSI) image sensor with a reflector | Min-Feng Kao, Dun-Nian Yaung, Jeng-Shyan Lin, Hsun-Ying Huang, Tzu-Hsuan Hsu | 2017-11-07 |
| 9806119 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Dun-Nian Yaung | 2017-10-31 |
| 9786592 | Integrated circuit structure and method of forming the same | Jeng-Shyan Lin, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao, Hsun-Ying Huang | 2017-10-10 |