Issued Patents All Time
Showing 126–150 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566378 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Wen-De Wang, Hsiao-Hui Tseng | 2020-02-18 |
| 10566288 | Structure for standard logic performance improvement having a back-side through-substrate-via | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2020-02-18 |
| 10535696 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2020-01-14 |
| 10535706 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2020-01-14 |
| 10535697 | Structure and method for 3D Image sensor | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2020-01-14 |
| 10522525 | Semiconductor device structure | Cheng-Ying Ho, Wen-De Wang, Dun-Nian Yaung | 2019-12-31 |
| 10515994 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2019-12-24 |
| 10510792 | 3DIC seal ring structure and methods of forming same | Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Dun-Nian Yaung | 2019-12-17 |
| 10510791 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2019-12-17 |
| 10510912 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Bruce C. S. Chou +2 more | 2019-12-17 |
| 10510729 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, U-Ting Chen, Shih Pei Chou | 2019-12-17 |
| 10510592 | Integrated circuit (IC) structure for high performance and functional density | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Kuan-Chieh Huang | 2019-12-17 |
| 10510542 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung | 2019-12-17 |
| 10510790 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Dun-Nian Yaung | 2019-12-17 |
| 10504784 | Inductor structure for integrated circuit | Shih-Han Huang, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Min-Feng Kao | 2019-12-10 |
| 10475828 | Image sensor device structure with doping layer in light-sensing region | Yen-Ting Chiang, Chun-Yuan Chen, Hsiao-Hui Tseng, Yu-Jen Wang, Shyh-Fann Ting +2 more | 2019-11-12 |
| 10475843 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen | 2019-11-12 |
| 10468441 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2019-11-05 |
| 10468443 | Pixel structure of image sensor and method of forming same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2019-11-05 |
| 10461109 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yen-Ting Chiang +2 more | 2019-10-29 |
| 10361233 | High-k dielectric liners in shallow trench isolations | Szu-Ying Chen, Tzu-Jui Wang, Dun-Nian Yaung | 2019-07-23 |
| 10304886 | Back-side deep trench isolation (BDTI) structure for pinned photodiode image sensor | Yen-Ting Chiang, Dun-Nian Yaung, Hsiao-Hui Tseng, Yu-Jen Wang, Chun-Yuan Chen | 2019-05-28 |
| 10304818 | Method of manufacturing semiconductor devices having conductive plugs with varying widths | Shu-Ting Tsai, Dun-Nian Yaung, Szu-Ying Chen, U-Ting Chen | 2019-05-28 |
| 10304889 | Image sensor device and manufacturing method thereof | Wei Chuang Wu, Ming-Tsong Wang, Feng-Chi Hung, Ching-Chun Wang | 2019-05-28 |
| 10290671 | Image sensor device and method of forming same | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2019-05-14 |