Issued Patents All Time
Showing 151–175 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276622 | Mechanisms for forming image-sensor device with expitaxial isolation feature | Wen-I Hsu, Feng-Chi Hung, Chun-Chieh Chuang, Dun-Nian Yaung | 2019-04-30 |
| 10276619 | Semiconductor device structure with a conductive feature passing through a passivation layer | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2019-04-30 |
| 10269863 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2019-04-23 |
| 10269848 | Image sensor having enhanced backside illumination quantum efficiency | Yin-Kai Liao, Han-Chi Liu, Yuan-Hung Liu, Dun-Nian Yaung | 2019-04-23 |
| 10269840 | Image sensing device and manufacturing method thereof | Feng-Chi Hung, Ching-Chun Wang, Tse-Hua Lu | 2019-04-23 |
| 10192918 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Dun-Nian Yaung, Chun-Chieh Chuang, Volume Chien | 2019-01-29 |
| 10177186 | Pixel structure of image sensor and method of forming same | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2019-01-08 |
| 10163956 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou +2 more | 2018-12-25 |
| 10163973 | Method for forming the front-side illuminated image sensor device structure with light pipe | Feng-Kuei Chang, Keng-Yu Chou, Jeng-Shyan Lin | 2018-12-25 |
| 10163878 | Semiconductor structure and method for manufacturing the same | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Ching-Chun Wang | 2018-12-25 |
| 10163951 | Image sensor device | Szu-Ying Chen, Min-Feng Kao, Feng-Chi Hung, Dun-Nian Yaung | 2018-12-25 |
| 10163758 | Semiconductor structure and manufacturing method for the same | Min-Feng Kao, Dun-Nian Yaung, Ching-Chun Wang, Kuan-Chieh Huang, Hsing-Chih Lin +1 more | 2018-12-25 |
| 10164133 | Image sensor device and method | Kuo-Chin Huang, Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Bruce C. S. Chou +2 more | 2018-12-25 |
| 10157959 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-12-18 |
| 10157958 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Szu-Ying Chen, Wen-De Wang +1 more | 2018-12-18 |
| 10157891 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, U-Ting Chen, Shih Pei Chou | 2018-12-18 |
| 10153316 | Mechanisms for forming image sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung | 2018-12-11 |
| 10147682 | Structure for stacked logic performance improvement | Min-Feng Kao, Dun-Nian Yaung, Hsun-Ying Huang | 2018-12-04 |
| 10141358 | Semiconductor switching device separated by device isolation | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2018-11-27 |
| 10134794 | Image sensor chip sidewall interconnection | Kuo-Chin Huang, Pao-Tung Chen, Wei-Chieh Chiang, Kazuaki Hashimoto | 2018-11-20 |
| 10128304 | Isolation for semiconductor devices | Wen-I Hsu, Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Wen-De Wang | 2018-11-13 |
| 10121812 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2018-11-06 |
| 10096645 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Dun-Nian Yaung +1 more | 2018-10-09 |
| 10096515 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung, Chih-Hui Huang +3 more | 2018-10-09 |
| 10092768 | Interconnect structure and method of forming same | Shu-Ting Tsai, Jeng-Shyan Lin, Chun-Chieh Chuang, Dun-Nian Yaung, Feng-Chi Hung | 2018-10-09 |