Issued Patents All Time
Showing 301–325 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8933527 | Elevated photodiodes with crosstalk isolation | Yi-Shin Chu, Cheng-Tao Lin, Meng-Hsun Wan, Szu-Ying Chen, Dun-Nian Yaung | 2015-01-13 |
| 8900966 | Alignment for backside illumination sensor | Dun-Nian Yaung, Shou-Gwo Wuu | 2014-12-02 |
| 8895349 | Backside illuminated image sensor having capacitor on pixel region | Chun-Chieh Chuang, Dun-Nian Yaung, Jeng-Shyan Lin, Wen-De Wang | 2014-11-25 |
| 8883544 | Method of forming an image device | Szu-Ying Chen, Min-Feng Kao, Feng-Chi Hung, Dun-Nian Yaung | 2014-11-11 |
| 8878325 | Elevated photodiode with a stacked scheme | Meng-Hsun Wan, Yi-Shin Chu, Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2014-11-04 |
| 8878242 | Pickup device structure within a device isolation region | Min-Feng Kao, Dun-Nian Yaung, Tzu-Hsuan Hsu, Szu-Ying Chen, Wei-Cheng Hsu +1 more | 2014-11-04 |
| 8816457 | Sensor structure for optical performance enhancement | Jyh-Ming Hung, Dun-Nian Yaung, Chun-Chieh Chuang | 2014-08-26 |
| 8810700 | Front side implanted guard ring structure for backside | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2014-08-19 |
| 8809098 | Back side defect reduction for back side illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Yeur-Luen Tu, Keng-Yu Chou, Chung Chien Wang | 2014-08-19 |
| 8802538 | Methods for hybrid wafer bonding | Ping-Yin Liu, Xiaomeng Chen, Xin-Hua Huang, Hung-Hua Lin, Lan-Lin Chao +1 more | 2014-08-12 |
| 8766387 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Dun-Nian Yaung, Szu-Ying Chen, Wen-De Wang +1 more | 2014-07-01 |
| 8736006 | Backside structure for a BSI image sensor device | Shuang-Ji Tsai, Dun-Nian Yaung, Feng-Chi Hung, Jeng-Shyan Lin, Chun-Chieh Chuang +1 more | 2014-05-27 |
| 8710612 | Semiconductor device having a bonding pad and shield structure of different thickness | Shuang-Ji Tsai, Dun-Nian Yaung, Wen-De Wang, Jeng-Shyan Lin, Cheng-Ying Ho | 2014-04-29 |
| 8709854 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Dun-Nian Yaung, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2014-04-29 |
| 8710607 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Tzu-Jui Wang, Dun-Nian Yaung | 2014-04-29 |
| 8685820 | Multiple gate dielectric structures and methods of forming the same | Hsiao-Hui Tseng, Dun-Nian Yaung, Wen-I Hsu, Min-Feng Kao | 2014-04-01 |
| 8674467 | Image sensor and method of fabricating same | Wen-De Wang, Dun-Nian Yaung, Chun-Chieh Chuang, Jeng-Shyan Lin | 2014-03-18 |
| 8669135 | System and method for fabricating a 3D image sensor structure | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang | 2014-03-11 |
| 8664736 | Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same | Shuang-Ji Tsai, Dun-Nian Yaung, Jeng-Shyan Lin, Wen-De Wang, Yueh-Chiou Lin | 2014-03-04 |
| 8629523 | Inserted reflective shield to improve quantum efficiency of image sensors | Yu-Hao Shih, Szu-Ying Chen, Hsing-Lung Chen, Dun-Nian Yaung, Volume Chien | 2014-01-14 |
| 8629524 | Apparatus for vertically integrated backside illuminated image sensors | Tzu-Jui Wang, Szu-Ying Chen, Dun-Nian Yaung, Ping-Yin Liu, Lan-Lin Chao | 2014-01-14 |
| 8614495 | Back side defect reduction for back side illuminated image sensor | Chun-Chieh Chuang, Dun-Nian Yaung, Yeur-Luen Tu, Keng-Yu Chou, Chung Chien Wang | 2013-12-24 |
| 8604405 | Backside illuminated image sensor device with refractive index dependent layer thicknesses and method of forming the same | Han-Chi Liu, Jeng-Shyan Lin, Dun-Nian Yaung, Wen-De Wang, Chun-Chieh Chuang | 2013-12-10 |
| 8569807 | Backside illuminated image sensor having capacitor on pixel region | Chun-Chieh Chuang, Dun-Nian Yuang, Jeng-Shyan Lin, Wen-De Wang | 2013-10-29 |
| 8564085 | CMOS image sensor structure | Min-Feng Kao, Dun-Nian Yaung, Chun-Chieh Chuang, Wen-De Wang | 2013-10-22 |