Issued Patents All Time
Showing 351–367 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6909675 | Method for switching an optical disc apparatus to different accessing speeds | — | 2005-06-21 |
| 6884728 | Method for removing polymeric residue contamination on semiconductor feature sidewalls | Jun-Lung Huang, Ching-Hui Ma, Yi-Chen Huang, Yin-Shen Chu, Hong-Ming Chen +1 more | 2005-04-26 |
| 6828251 | Method for improved plasma etching control | Yi-Nien Su, Li-Chih Chaio | 2004-12-07 |
| 6790770 | Method for preventing photoresist poisoning | Chao-Cheng Chen, Jyu-Horng Shieh | 2004-09-14 |
| 6727183 | Prevention of spiking in ultra low dielectric constant material | Ching-Hui Ma, Li-Chih Chao | 2004-04-27 |
| 6429119 | Dual damascene process to reduce etch barrier thickness | Li-Chih Chao, Chia-Shiung Tsai, Ming-Huei Lui, Chao-Cheng Chen | 2002-08-06 |
| 6399483 | Method for improving faceting effect in dual damascene process | Ming-Huei Lui, Hun-Jan Tao, Chia-Shiung Tsai | 2002-06-04 |
| 6383943 | Process for improving copper fill integrity | Chao-Cheng Chen, Jyu-Horng Shieh, Chia-Shiung Tsai, Bor-Shyang Lin | 2002-05-07 |
| 6323121 | Fully dry post-via-etch cleaning method for a damascene process | Chao-Cheng Chen, Li-Chih Chao, Chia-Shiung Tsai, Ming-Huei Lui | 2001-11-27 |
| 6319821 | Dual damascene approach for small geometry dimension | Chen-Cheng Kuo, Chia-Shiung Tsai, Hung-Chang Hsieh | 2001-11-20 |
| 6309962 | Film stack and etching sequence for dual damascene | Chao-Cheng Chen, Li-Chi Chao, Min-Huei Lui, Chia-Shiung Tsai | 2001-10-30 |
| 6297168 | Edge defect inhibited trench etch plasma etch method | Jyu-Horng Shieh, Chao-Cheng Chen, Li-Chi Chao, Chia-Shia Tsai | 2001-10-02 |
| 6242362 | Etch process for fabricating a vertical hard mask/conductive pattern profile to improve T-shaped profile for a silicon oxynitride hard mask | Huan-Just Lin, Chia-Shiung Tsai, Yung-Kuan Hsaio | 2001-06-05 |
| 6225203 | PE-SiN spacer profile for C2 SAC isolation window | Jen-Shiang Leu, Chia-Shiung Tsai | 2001-05-01 |
| 6211063 | Method to fabricate self-aligned dual damascene structures | Chia-Shia Tsai | 2001-04-03 |
| 6211061 | Dual damascene process for carbon-based low-K materials | Chao-Cheng Chen, Ming-Huei Lui, Li-Chih Chao, Chia-Shiung Tsai | 2001-04-03 |
| 6140218 | Method for fabricating a T-shaped hard mask/conductor profile to improve self-aligned contact isolation | Li-Chih Chao, Huan-Just Lin, Yung Kuan Hsiao | 2000-10-31 |