BL

Bor-Shyang Lin

TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #3,543,568 of 4,157,543Top 90%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6383943 Process for improving copper fill integrity Chao-Cheng Chen, Jen-Cheng Liu, Jyu-Horng Shieh, Chia-Shiung Tsai 2002-05-07