Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6647994 | Method of resist stripping over low-k dielectric material | Mei-Hui Sung | 2003-11-18 |
| 6440838 | Dual damascene structure employing laminated intermediate etch stop layer | Mei-Hui Sung | 2002-08-27 |
| 6429119 | Dual damascene process to reduce etch barrier thickness | Li-Chih Chao, Chia-Shiung Tsai, Jen-Cheng Liu, Chao-Cheng Chen | 2002-08-06 |
| 6399483 | Method for improving faceting effect in dual damascene process | Jen-Cheng Liu, Hun-Jan Tao, Chia-Shiung Tsai | 2002-06-04 |
| 6323121 | Fully dry post-via-etch cleaning method for a damascene process | Jen-Cheng Liu, Chao-Cheng Chen, Li-Chih Chao, Chia-Shiung Tsai | 2001-11-27 |
| 6211061 | Dual damascene process for carbon-based low-K materials | Chao-Cheng Chen, Jen-Cheng Liu, Li-Chih Chao, Chia-Shiung Tsai | 2001-04-03 |